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Inline Type Applications:
Our Inline Type systems are widely used in processes requiring plasma pre-treatment or surface modification in industries such as IC packging, LED packaging, camera modules (including VR lenses), circuit boards, and thermal module industries.
Highlights of Inline Type Equipments
Refined and Practical Design:
Combines both aesthetics and functionality.Compatible with Existing Automation Lines:
Can be easily integrated with the customer's existing automated production lines.Variety of Models: Offers a wide range of options to meet different needs.
World's Smallest Four-Track Inline Model: Features the most compact four-track inline system available globally.
Hardware Design Options
To meet diverse customer needs, we offer a variety of inline design types, including the following five options:
Dual Plate Alternating Type (Single/Multiple Plates): Allows for efficient processing with alternating plates.
Single Track Type (Conveyor Feed/Manual Feed/Cassette): Flexible design for different feeding methods.
Multi-Track Type (Magazine/Cassette): Suitable for handling multiple items simultaneously.
Dual Chamber Type (Translating Track): Features two chambers with a moving track for enhanced processing efficiency.
3D Multi-Layer Type (Double-Sided Processing): Enables processing on multiple layers and both sides of the components.
The Dual Plate Alternating Type (Single/Multiple Plates) system has a compact footprint, with fast loading and unloading speeds, resulting in high production capacity.
The Single Track Type (Conveyor Feed/Manual Feed/Cassette Feed) system is widely used in the mini LED industry, as well as for specialized glass substrates and circuit board applications. It can accommodate larger single-piece substrates running on the production line, providing efficient and continuous processing for these applications.
The Multi-Track Type (Magazine/Cassette) system can be designed for single-side or dual-side loading and unloading. The tracks can range from a single track up to six tracks (for 75mm wide substrates). This design is particularly suitable for high-end IC packaging equipment. Additionally, a DUC (Dry Ultrasonic Clean) module can be added upon customer request, as shown in the diagram below.
The Dual Chamber Type (Translating Track) system features two independent chambers that operate separately, designed to increase production capacity for large single-piece substrates on a single track. The system shares one loading and unloading track, combined with a translating track for efficient material handling and processing.
The 3D Multi-Layer Type (Double-Sided Processing) system can accommodate up to five layers (with a recommended range of 3 to 5 layers). It is designed for materials requiring double-sided plasma treatment. The system allows for multi-layer stacking during loading and unloading, enabling simultaneous processing of all layers once inside the vacuum chamber.
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