CO2 Snow Jet equipment is a dry process and serves as the final piece in our surface modification equipment series. In addition to traditional wet cleaning methods, it offers an alternative to technologies such as vacuum plasma, atmospheric plasma, and DUC (Dry Ultrasonic Cleaning). It is particularly effective for removing strongly adhered or larger particles such as residual glue, flux, metal burrs, carbon residue from laser processing, organic residues, dust, oil, and microparticles. CO2 Snow Jet can also be integrated with our other surface modification and cleaning equipment for combined processes.
Unlike dry ice cleaning, CO2 Snow Jet uses liquid CO2 as its raw material (supplied by a cylinder). Through our system, it can create a temporary coexistence of solid, liquid, and gas CO2. By leveraging both physical and chemical processes, it effectively removes contaminants from the treated surface.
This process does not damage or corrode the product's surface, and it does not generate secondary pollution (no residue). Since there are no chemical emissions or recovery issues, it is environmentally friendly. Additionally, it does not require energy-consuming baking equipment, resulting in relatively low overall operating costs.
Features and Advantages of Our CO2 Snow Jet
The system is equipped with a standard pressure stabilization module to ensure constant pressure at the Liquid CO2 nozzle outlet.
High utilization rate of liquid CO2 cylinders.
The lowest Total Cost of Ownership (TCO) in the industry, with liquid CO2 consumption as low as 50 grams per minute.
Optional real-time cylinder usage monitoring system, providing timely feedback on the remaining cylinder volume.
Dual modes: manual or automated connection, similar to our atmospheric plasma power systems, allowing for multiple equipment parameters to be read.
No icing at the nozzle outlet, and no frost on the product surface during treatment.
The equipment offers multiple nozzle configurations: single, dual, or multiple nozzles.
Cleaning of carbon residues after PCB laser micro-hole processing
Removal of PCB ink
Removal of contaminants from LCD COF